SMT

Printing

Maximum PCB size can be processed

900*600mm2

Maximum plate mass

8kg

Actual printing accuracy

±25μm（6σ）

System calibration repeatability

±10μm（6σ）

Scraper pressure detection

Pressure closed-loop control system

SPI

Detects the smallest ball spacing

100μm

X-YAxis accuracy

0.5μm

False Positive Rate

≤0.1%

Patches

The size range of components that can be processed

0.3*0.15 mm2--200*125 mm2

The maximum height of the machinable component

25.4mm

Maximum mass of machinable components

100g

BGA/CSPMinimum ball spacing, ball diameter

0.30mm，0.15mm

Placement accuracy

±22μm（3σ），±0.05°（3σ）

The size range of the panels that can be processed

50*50 mm2—850*560 mm2

Plate thickness range

0.3mm--6mm

Maximum plate mass

6kg

The maximum number of material types that can be placed on the line

500

AOI

Detects even the smallest components

1005

Defects can be detected

Wrong material, missing parts, reverse, placement deviation, monument, side standing, open welding, tinning, turning over

Foot Lifting

3DDetection function

Reflux

Temperature accuracy

±1℃

Weld protection

Nitrogen protection (residual oxygen < 3000ppm)

Nitrogen control

Nitrogen closed-loop automatic control system, ± 200ppm

3D X-Ray

Magnification

Geometric magnification 2000; The system magnification is 12000

Resolution

1μm /nm

Rotation angle & tilt viewing angle

any ±45°+360°Revolve

AXI

Detects even the smallest components

1005

Detects the smallest pin spacing

0.4mm（QFP）

Detects the smallest tin thickness

0.0127mm

DIP

Pre-processing

Automatic component forming technology

Automatic component molding

Plug-ins

Plug-in technology

Fully automatic plug-in machine

Wave soldering

Crest type

Pop, select wave

Carriage rail inclination

4--7°

Pop Wave welding temperature accuracy

±3℃

Wave selection crest stability accuracy

±0.06 mm

Weld protection

Nitrogen protection

Crimping technology

Crimp PCB maximum size

800*600mm2

Down-pressure height accuracy

±0.02mm

Pressure range

0-50KN

Pressure accuracy

±2% of standard value

Dwell time

0—9.999S

Coating technology

Maximum machinable plate size

500*475*6mm3

Maximum quality of veneer

5kg

Minimum sprinkler diameter

2mm

Other features

The spraying pressure can be programmed

ICTTest

Test level

Device-level testing to test the hardware connection status

Number of test points

＞4096

Test content

Contact test, open and short circuit test, resistance and capacitance test, two- and three-stage field effect cell test, no-power hybrid test, boundary scan chain test, power-on hybrid mode test

Washing

Maximum width of the panel

457.2mm

Maximum height of the panel

102mm

Device features

Single/double hurricane jets, S-shaped nozzles, electric air knives

Assembly and testing

Product range

Server products

Small cells、ODU

Communication products

Communication motherboard, backplane

Medical products

CT、CT probe, B-ultrasound, color ultrasound, medical monitor

FTTest

Test level

System-level testing of the circuit board to test the functional status of the system

Temperature cycle test

Temperature range

-60℃--125℃

Temperature rise and fall rate

＞10℃/min

Temperature deviations

≤2℃

Other reliability analysis tests

Aging, dropping, vibration, abrasion resistance, key life and other tests

Management tools/software

IMS

Assist in material management in warehouse, material preparation group, and production

MES

The manufacturing execution system is mainly used for production process control, ECN execution control, foolproof control, data traceability, etc

Oracle

Management of procurement processes, costs, finances, work order planning, etc

ECN System

ECNManagement system to avoid missing ECN execution and quickly respond to engineering change projects

Labview

It provides a graphical programming environment to enhance the data collection, analysis, monitoring and management capabilities of equipment and instruments in the manufacturing process, and at the same time makes the communication of each terminal computer closer and convenient for system construction